RIO RANCHO, N.M.–(BUSINESS WIRE)–Jan 24, 2024–
What’s New: Today, Intel celebrated the opening of Fab 9, its cutting-edge factory in Rio Rancho, New Mexico. The milestone is part of Intel’s previously announced $3.5 billion investment to equip its New Mexico operations for the manufacturing of advanced semiconductor packaging technologies, including Intel’s breakthrough 3D packaging technology, Foveros, which offers flexible options for combining multiple chips that are optimized for power, performance and cost.
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A drone photo shows Intel’s new Fab 9 in Rio Rancho, New Mexico, in January 2024. Fab 9 is part of Intel’s previously announced $3.5 billion investment to equip its New Mexico operations for the manufacturing of advanced semiconductor packaging technologies. (Credit: Intel Corporation)
“Today, we celebrate the opening of Intel’s first high-volume semiconductor operations and the only U.S. factory producing the world’s most advanced packaging solutions at scale. This cutting-edge technology sets Intel apart and gives our customers real advantages in performance, form factor and flexibility in design applications, all within a resilient supply chain. Congratulations to the New Mexico team, the entire Intel family, our suppliers, and contractor partners who collaborate and relentlessly push the boundaries of packaging innovation.”