Texas Governor Greg Abbott announced today that a Texas Semiconductor Innovation Fund (TSIF) grant of $33.6 million has been extended to Texas Instruments Incorporated (TI) for expanded capacity and technology investments at their 300mm semiconductor wafer fab in Richardson (RFAB). The project is expected to total $700 million in capital investment.
“Texas is where the integrated circuit was born and where the future is forged,” said Governor Abbott. “Texas Instruments is a global trailblazer, and this expansion of their historic, long-term investment in our great state advances Texas’ leadership in semiconductor manufacturing. Texas has the innovation, the infrastructure, and the talent to manufacture the technologies that will change the future of the world.”
Texas Instruments, a Fortune 500 company headquartered in Dallas, is the birthplace of the world’s first commercial silicon transistor in 1954, followed by Jack Kilby’s invention of the integrated circuit in 1958. Today, TI is the largest foundational semiconductor manufacturer in the U.S., producing analog and embedded processing chips that are critical for satellites, vehicles, smartphones, and nearly every other electronic device. TI’s continued investment in RFAB will expand capacity, enable process technologies, and enhance the facilities’ capabilities to manufacture TI’s broad product portfolio on 300mm wafers, the largest and most advanced diameter size for silicon wafers…