Aug. 28 (Asia Today) — South Korean chipmaker SK hynix has broken ground on a more than $4 billion advanced packaging facility in Indiana that will serve as its first U.S. production base for next-generation high-bandwidth memory.
The company said Friday it held a groundbreaking ceremony Thursday at Purdue University’s Holloway Gymnasium in West Lafayette, Ind., for the advanced packaging facility for artificial intelligence memory.
Advanced packaging is a semiconductor back-end process that combines multiple chips into a single package or stacks them vertically to improve performance as conventional chip miniaturization approaches its physical limits.
Indiana Gov. Mike Braun, U.S. Sen. Todd Young, Purdue University President Mitch Daniels and Robert Abrams, chairman of the Korea-US Alliance Foundation, attended the ceremony…